Incazelo ye-COB encapsulation
I-COB ibizwa nge-Chips on Board (COB), okuwubuchwepheshe bokuxazulula inkinga yokukhishwa kokushisa kwe-LED. Uma kuqhathaniswa nobuchwepheshe be-inline kanye ne-SMD, inezici ezimbalwa zokonga isikhala, ukupakisha okwenziwe lula, nokuphatha okushisayo okuphumelelayo kakhulu.
I-COB encapsulation, okungukuthi, i-chip Ebhodini, iwukunamathela i-chip engenalutho ku-interconnect substrate ngeglue eqhubayo noma engeyona e-conductive, bese yenza i-wire bonding ukuze kutholakale uxhumano lukagesi. Uma i-chip engenalutho ivezwe ngokuqondile emoyeni, iyakwazi ukungcoliswa noma ukulimala komuntu, okuthinta noma ukucekela phansi umsebenzi we-chip, ngakho-ke i-chip kanye nentambo yokubopha ihlanganiswe neglue. Le phakheji ibizwa nangokuthi i-encapsulation ethambile.
Izinzuzo zokupakisha kwe-COB
1. I-Ultra-thin: Ngokwezidingo zangempela zamakhasimende, ibhodi le-PCB elinogqinsi olusuka ku-0.4-1.2mm lingasetshenziswa ukunciphisa isisindo sibe yi-1/3 yemikhiqizo yendabuko yasekuqaleni, enganciphisa kakhulu ukwakheka, ezokuthutha kanye nobunjiniyela. izindleko zamakhasimende.
2. Ukuvimbela ukushayisana nokucindezelwa: Umkhiqizo we-COB uhlanganisa ngokuqondile i-chip ye-LED endaweni yesibani se-concave yebhodi le-PCB, bese welashwa nge-epoxy resin. Ingaphezulu lephoyinti lesibani li-convex libe indawo eyindilinga, ebushelelezi futhi eqinile, futhi amelana nokungqubuzana nokuguga.
3. I-engeli enkulu yokubuka: Iphakethe le-COB lisebenzisa ukukhanya okuyisiyingi okungashoni kahle, i-engeli yokubuka ingaphezu kwamadigri angu-175, isondele kumadigri angu-180, futhi inomphumela wokufiphalisa umbala ohlukanisiwe ongcono.
4. Iyagobeka: Umthamo wokugoba uyisici esiyingqayizivele sokuhlanganisa i-COB. Ukugoba kwe-PCB akubangi umonakalo kuma-chips e-LED ahlanganisiwe. Ngakho-ke, izikrini ze-arc ze-LED, izikrini eziyindilinga, nezikrini ze-wavy zingenziwa kalula kusetshenziswa amamojula we-COB. Kuyi-substrate ekahle yezikrini ezenzelwe wena kumabha nama-nightclub. Ingakwazi ukuhlukaniswa ngaphandle komthungo, isakhiwo sokukhiqiza silula, futhi intengo iphansi kakhulu kunesikrini esimise okwe-LED esenziwe ibhodi lesifunda eliguquguqukayo kanye nemojula yokubonisa yendabuko.
5. Ukushisa okuqinile kokushisa: Imikhiqizo ye-COB ihlanganiswe ebhodini le-PCB, futhi ukushisa kwe-wick kudluliselwa ngokushesha nge-foil yethusi ebhodini le-PCB. Ugqinsi lwecwecwe lethusi lebhodi le-PCB linezidingo zobuchwepheshe eziqinile, futhi ngenxa yenqubo yokucwiliswa kwegolide, akubangeli ukuncisha ukukhanya okukhulu. Ngakho-ke, kuncane kakhulu ukulimala kwe-LED futhi imikhiqizo ye-COB yandisa kakhulu impilo.
6, ayigugi, kulula ukuyihlanza: ingaphezulu lephoyinti lesibani liyindilinga libe yindilinga, libushelelezi futhi liqinile, alikwazi ukungqubuzana futhi aligugi; Uma kunezindawo ezifile, ungakwazi ukulungisa iphuzu ngephuzu; akukho imaski, uthuli lungahlanzwa ngamanzi noma ngendwangu.
I-7, izici ezinhle kakhulu zesimo sezulu saso sonke: i-anti-oxidation, i-anti-oxidation, umphumela wokumelana ne-UV, ukumelana nokugqwala, ukuvimbela uthuli, ukuphela kwe-anti-static, i-anti-oxidation, umphumela wokumelana ne-UV uvelele. Ngakho iyakwazi ukuhlangabezana nezimo zokusebenza zesimo sezulu sonke, umehluko wokushisa we-minus 30 degrees kuya ku-zero 80 degrees usengasetshenziswa ngokujwayelekile.