Isizathu sokuthi kungani umthombo wokukhanya we-LED ushisiwe
Ukushisa kwe-PN junction ye-LED kuqala kuqhutshwa ebusweni be-wafer nge-wafer semiconductor material ngokwayo, enokumelana okuthile kokushisa. Ngokombono wengxenye ye-LED, kuye ngesakhiwo sephakheji, kukhona nokumelana okushisayo kwamasayizi ahlukene phakathi kwe-wafer kanye nomnikazi. Isamba salokhu kumelana nokushisa okubili kwakha ukumelana nokushisa kwe-Rj-a ye-LED. Ngokombono womsebenzisi, ipharamitha ye-Rj-a ye-LED ethile ayikwazi ukushintshwa. Lena inkinga izinkampani zokupakisha ze-LED okudingeka ziyifunde, kodwa kungenzeka ukunciphisa inani le-Rj-a ngokukhetha imikhiqizo noma amamodeli avela kubakhiqizi abahlukene.
Ezikhanyisini ze-LED, indlela yokudlulisa ukushisa ye-LED iyinkimbinkimbi kakhulu. Indlela eyinhloko yi-LED-PCB-heatsink-fluid. Njengomklami wezikhanyisi, umsebenzi ophusile ngempela uwukuthuthukisa impahla ye-luminaire kanye nesakhiwo sokukhipha ukushisa ukuze kuncishiswe izingxenye ze-LED ngangokunokwenzeka. Ukumelana nokushisa phakathi koketshezi.
Njengesithwali sokukhweza izingxenye ze-elekthronikhi, izingxenye ze-LED zixhunywe ngokuyinhloko ebhodini lesifunda ngokufaka i-soldering. Ukumelana okuphelele kokushisa kwebhodi lesifunda elisekelwe ensimbi kuncane kakhulu. Okuvame ukusetshenziswa ama-copper substrates nama-aluminium substrates, kanti ama-aluminium substrates anenani eliphansi uma kuqhathaniswa. Kuye kwamukelwa kabanzi yimboni. Ukumelana okushisayo kwe-aluminium substrate kuyahlukahluka kuye ngokuthi inqubo yabakhiqizi abahlukene. Ukumelana nokushisa okulinganiselwe kungu-0.6-4.0 ° C / W, futhi umehluko wentengo mkhulu kakhulu. I-aluminium substrate ngokuvamile inezingqimba ezintathu ezibonakalayo, ungqimba lwezintambo, ungqimba oluvikelayo, kanye nolwendlalelo olungaphansi. I-conductivity kagesi yezinto ezijwayelekile zokuvikela ugesi nayo impofu kakhulu, ngakho-ke ukumelana nokushisa ikakhulukazi kuvela kungqimba lwe-insulating, futhi izinto zokuvikela ezisetshenzisiwe zihluke kakhulu. Phakathi kwazo, i-ceramic-based insulating medium inokumelana okuncane kakhulu kokushisa. I-aluminium substrate engabizi kakhulu ngokuvamile ungqimba lwengilazi olufaka imicu yengilazi noma ungqimba oluvikela inhlaka. Ukumelana nokushisa nakho kuhlobene kahle nobukhulu bengqimba yokufakelwa.
Ngaphansi kwezimo zezindleko nokusebenza, uhlobo lwe-aluminium substrate nendawo ye-aluminium substrate kukhethwe ngokunengqondo. Ngokuphambene, idizayini elungile yesimo sokucwilisa ukushisa kanye nokuxhumana okungcono kakhulu phakathi kosinki wokushisa kanye ne-aluminium substrate kuyisihluthulelo sempumelelo yomklamo we-luminaire. Isici sangempela ekunqumeni inani lokukhishwa kokushisa indawo yokuxhumana ye-heater sink enoketshezi kanye nezinga lokugeleza koketshezi. Izibani ezijwayelekile ze-LED zihlakazwa ngokuzenzakalelayo yi-convection yemvelo, futhi imisebe eshisayo nayo ingenye yezindlela eziyinhloko zokuqeda ukushisa.
Ngakho-ke, singakwazi ukuhlaziya izizathu zokwehluleka kwezibani ze-LED ukukhipha ukushisa:
1. Umthombo wokukhanya we-LED unokumelana okukhulu kokushisa, futhi umthombo wokukhanya awuchithi. Ukusetshenziswa kwe-thermal paste kuzobangela ukunyakaza kokukhipha ukushisa kuhluleke.
2.I-aluminium substrate isetshenziswa njengomthombo wokukhanya wokuxhuma kwe-PCB. Njengoba i-aluminium substrate inokumelana nokushisa okuningi, umthombo wokushisa womthombo wokukhanya awukwazi ukudluliselwa, futhi ukusetshenziswa kwe-thermal conductive paste kungase kubangele ukunyakaza kokukhipha ukushisa kuhluleke.
3.Asikho isikhala sokubhafa okushisayo kwendawo ekhipha ukukhanya, okuzokwenza ukuthi ukuchithwa kokushisa komthombo wokukhanya we-LED kuhluleke, futhi ukubola kokukhanya kuthuthukisiwe. Izizathu ezintathu ezingenhla ziyizizathu eziyinhloko zokuhluleka kwemishini yokukhanyisa i-LED embonini, futhi asikho isisombululo esiphelele. Ezinye izinkampani ezinkulu zisebenzisa i-ceramic substrate ukuze zihlakaze iphakethe lobuhlalu besibani, kodwa azikwazi ukusetshenziswa kabanzi ngenxa yezindleko eziphezulu.
Ngakho-ke, kuye kwahlongozwa ukuthuthukiswa okuthile:
1. Ukwenziwa roughening ebusweni usinki wokushisa wesibani se-LED kungenye yezindlela zokuthuthukisa ngempumelelo amandla okukhipha ukushisa.
Ukwehliswa komhlaba kusho ukuthi akukho ndawo ebushelelezi esetshenziswayo, engazuzwa ngezindlela ezingokomzimba namakhemikhali. Ngokuvamile, kuyindlela yokuqhunyiswa kwesihlabathi kanye ne-oxidation. Ukufaka imibala kuyindlela yamakhemikhali, engaqedwa kanye ne-oxidation. Lapho uklama ithuluzi lokugaya iphrofayili, kungenzeka ukuthi wengeze izimbambo ezithile phezulu ukuze kwandiswe indawo engaphezulu ukuze kuthuthukiswe amandla okukhipha ukushisa kwesibani se-LED.
2. Indlela evamile yokwandisa amandla emisebe yokushisa ukusebenzisa indawo yokwelapha enombala omnyama.