Iindlela zokusombulula ukutshatyalaliswa kobushushu be-LED
3. 1 Ukukhetha i-substrate kunye ne-thermal conductivity enhle
Khetha substrates kunye conductivity elungileyo thermal, ezifana Al-based metal core eprintiweyo iibhodi zesekethe (MCPCBs), iiseramikhi, kunye substrates metal edityanisiweyo, ukukhawulezisa ukuchithwa ubushushu ukusuka umaleko epitaxial ukuya ubushushu isinki substrate. Ngokulungisa uyilo lwe-thermal yebhodi ye-MCPCB, okanye ukudibanisa ngokuthe ngqo i-ceramics kwi-substrate yesinyithi ukwenza i-metal-based low-temperature sintered ceramic substrate (LTCC2M) substrate, i-substrate ene-conductivity efanelekileyo ye-thermal kunye ne-coefficient encinci yokwandisa i-thermal inokufumaneka. .
3.2 Ukukhutshwa kobushushu kwi-substrate
Ukuze usasaze ubushushu kwi-substrate kwindawo ejikelezileyo ngokukhawuleza, ngoku, izinto zetsimbi ezine-conductivity efanelekileyo ye-thermal ezifana ne-Al kunye ne-Cu zidla ngokusetyenziswa njengama-heat sinks, kunye nokupholisa okunyanzeliswayo njengamafeni kunye nemibhobho yokushisa ye-loop yongezwa. Kungakhathaliseki ukuba yindleko okanye ukubonakala, izixhobo zokupholisa zangaphandle azifanelekanga ukukhanya kwe-LED. Ke ngoko, ngokomthetho wogcino lwamandla, ukusetyenziswa kweekeramics zepiezoelectric njengendawo yokutshisa ubushushu ukuguqula ubushushu bube kukungcangcazela kwaye kusetyenziswe ngokuthe ngqo amandla obushushu kuya kuba yenye yengqwalasela yophando lwexesha elizayo.
3.3 Indlela yokunciphisa ukuxhathisa kwe-thermal
Kwizixhobo eziphezulu zamandla e-LED, ukuxhathisa kwe-thermal iyonke sisimbuku sokuxhathisa kwe-thermal yeentsini ezininzi zobushushu kwindlela yobushushu ukusuka kwi-pn junction ukuya kwindawo yangaphandle, kubandakanywa ukuxhathisa ubushushu bangaphakathi kwe-thermal ye-LED ngokwayo kunye nobushushu bangaphakathi. shona kwibhodi yePCB. Ukumelana ne-thermal yeglue ye-thermal conductive, ukuxhathisa kwe-thermal yeglue ye-thermal conductive phakathi kwe-PCB kunye ne-sink yokushisa yangaphandle, kunye nokumelana ne-thermal ye-thermal sink yangaphandle, njl. imiqobo ekugqithiseni ubushushu. Ngoko ke, ukunciphisa inani leesinki zobushushu zangaphakathi kunye nokusebenzisa inkqubo yefilimu ebhityileyo ukuvelisa ngokuthe ngqo i-interface ebalulekileyo ye-electrode heat sinks kunye ne-insulation layers kwi-metal heat sink inokunciphisa kakhulu ukuxhathisa kwe-thermal. Le teknoloji inokuba yi-LED ephezulu yamandla kwixesha elizayo. Umkhombandlela ophambili wepakethe yokulahla ubushushu.
3.4 Ubudlelwane phakathi kokumelana ne-thermal kunye nomjelo wokutshatyalaliswa kobushushu
Sebenzisa elona jelo lifutshane linokubakho lokulahla ubushushu. Okukhona umjelo wokuchitha ubushushu ixesha elide, kokukhona uxhathiso olukhulu lwe-thermal kunye nokuba nokwenzeka okukhulu kweebhotile ze-thermal.